@Bimodal_user, you might mean the DeepSonic chip. The ERA chip is in both the Sphere Infinio I model line (I90, I70) and the plain Infinio IR line without the DeepSonic chip, i.e., no Spheric noise reduction.
I listen to the Windows Weekly podcast with hosts Paul Thurrott and Richard Campbell, well-known computer experts. One interesting podcast discussion possibly related to hearing aid models is why there are so many different models of the new Qualcomm Snapdragon X Elite ARM-based computer chip. The two hosts supposed chip BINNING had something to do with it. Modern computer chips have so many small processes that they canāt be produced with 100% perfection. Often many chips are fabricated on a single silicon wafer. Rather than only cut out and save the best-performing chips and throw away all the less-than-perfect copies on a wafer, the less-perfect copies can often be sold as a lower-performing model with fewer features. So, for example, the chip used in the I70 Sphere Infinio might have been produced with some bad DNN circuitry and might not crunch digital sound as efficiently as a Deep Sonic I90 chip. Thus, the I90 chip might be intrinsically more capable with better features and command a higher price. There might be a somewhat deficient chip in I70 that can still do much of the processing but must sell at a lower price. However, it still sells and does not cause a complete loss for that part of the wafer. Those who say, āItās the same chip in both models, but the OEM deliberately turned off some feature,ā would only be half right. If binning is occurring, all the dies on the wafer were intended to be the same premium chip, but some of them, by manufacturing vagaries didnāt make the grade.
This is pure speculation on my part for HAs, but binning is a common practice in the computer industry for other tech components.
What Is āBinningā for Computer Components? (How To Geek)